TOKYO—(BUSINESS WIRE)—May 15, 2006—
Sonics Inc.(R), the premier supplier of system-on-chip
(SoC) SMART Interconnects(TM) solutions, and their Asia-based
distributor Innotech will participate in the upcoming "SoC/SiP
Developer's Conference 2006" sponsored by Nikkei. The conference will
highlight current development techniques, EDA tools, IP (intellectual
property) and packaging technology for the development of complex
SoC/SiP designs. Sonics will discuss interconnect solutions for
heterogeneous multi-processor SoCs at a 40 minute seminar. In
addition, the company's SoC interconnects solutions using Sonics' SoC
development tool SonicsStudio(TM) will be demonstrated at their booth.
Who: Sonics, Inc. and Innotech
When: May 18 and 19 -- 10:00 to 18:00
Where: Tokyo Conference Center, Shinagawa
Sonics
Presentation: "On-chip interconnect solutions for
multiprocessor SoCs"
Friday, May 19 -- 15:10 to 15:50
Presented by: Kazuyoshi Suzuki,
Field Application Manager
Sonics Info: http://www.sonicsinc.com
Show Info: http://techon.nikkeibp.co.jp/seminar/060518.html
About Sonics
Sonics, Inc.(R) is the premier supplier of SMART Interconnect(TM)
solutions that deliver high SoC design predictability and increased
design efficiency. Major semiconductor and systems companies including
Broadcom, Texas Instruments, Toshiba, and Samsung have applied Sonics'
SMART Interconnects solutions in leading products in the wireless
communications, digital multimedia, automotive, and office products
markets. Sonics is a privately-held company funded by Cadence Design
Systems, Toshiba Corp., Samsung Ventures, and venture capital firms
Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt
Capital, JAFCO Ventures, and H&Q Asia-Pacific.
Sonics and the Sonics logo are registered trademarks and SMART
Interconnects and SonicsStudio are trademarks of Sonics, Inc. All
other trademarks are the property of their respective owners.
Contact:
Fast Forward Public Relations
Mary Jane Reiter, 408-725-1239
Email Contact
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